QUALCOMM Powers World's First 3G Handsets Based on 65-Nanometer Chipsets

- Advanced Process Technology Enables Rich Functionality for Slim and Power-Efficient Devices, Launching Worldwide Now -

SAN DIEGO, June 18 /PRNewswire-FirstCall/ -- QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced a significant milestone in semiconductor process technology as multiple 3G handsets powered by the Company's 65-nanometer (nm) chipsets began their worldwide commercial launch. At least three handset models are now commercially available and more than 40 additional models are expected to become available this year. The world's first 3G handsets based on 65 nm chips, these models leverage the 65 nm node of semiconductor manufacturing for cost effectiveness, greater power efficiency and slimmer form factors while supporting the high-speed data capabilities and advanced service opportunities offered by 3G technology.

"QUALCOMM is committed to continually raising the bar for wireless users, delivering richer functionality that is more affordable and offers a better experience," said Steve Mollenkopf, senior vice president of product management for QUALCOMM CDMA Technologies. "We are pleased to reach this milestone in cutting-edge process technology, together with our customers, and we look forward to enabling additional slim, smart and power-efficient 3G devices for the worldwide market."

The handset models are based on 65 nm Mobile Station Modem(TM) (MSM(TM)) chipsets manufactured for QUALCOMM by Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest foundry company.

    The 65 nm handset models include:

    -- The WCDMA (UMTS) U120 handset by Huawei
    -- The WCDMA (UMTS) KU250 handset by LG Electronics
    -- The HSDPA U700 handset by Samsung

QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, the speed with which handsets based on QUALCOMM's 65 nm chipsets become commercially available, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.

QUALCOMM is a registered trademark of QUALCOMM Incorporated. Mobile Station Modem and MSM are trademarks of QUALCOMM Incorporated. All other trademarks are the property of their respective owners.

     QUALCOMM Contacts:
     Kira Lee, QUALCOMM CDMA Technologies
     Phone:  1-858-845-7571
     Email:  qctpublicrelations@qualcomm.com

     Tina Asmar, Corporate Communications
     Phone:  1-858-845-5959
     Email:  corpcomm@qualcomm.com

     John Gilbert, Investor Relations
     Phone:  1-858-658-4813
     Email:  ir@qualcomm.com