QUALCOMM Announces Early Delivery of World's First Universal Mobile TV Chip

- Company's Universal Broadcast Modem Supporting MediaFLO, DVB-H and ISDB-T to Sample Ahead of Schedule -

SAN DIEGO, Feb. 12 /PRNewswire-FirstCall/ -- QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the Company's Universal Broadcast Modem (UBM) chip is sampling ahead of schedule. The UBM product delivers support for FLO(TM) technology, Digital Video Broadcasting -- Handheld (DVB-H) and one-segment Integrated Services Digital Broadcasting -- Terrestrial (ISDB-T) in a single chip, allowing handset manufacturers to address three of the world's leading standards with one solution. The early sampling accelerates the delivery of mobile TV capabilities to mass-market handsets around the world.

"QUALCOMM believes the adoption rate of mobile TV on handsets is poised to grow at an exponential rate, and we remain committed to supporting other standards that network operators may choose to deploy," said Mike Concannon, vice president of strategic products for QUALCOMM CDMA Technologies. "Our UBM product is designed to make handsets supporting mobile TV content into mass- market tiers and, once again, the engineering team at QUALCOMM is able to deliver ahead of schedule to meet our customers' requirements."

The UBM is designed as a companion to QUALCOMM's CDMA2000(R) and WCDMA/UMTS Mobile Station Modem(TM) (MSM(TM)) baseband chipsets. Specific performance features of the UBM solution include:

    *  Support for the entire UHF bandwidth -- 470 to 862 MHz

    *  Tunable modes 5, 6, 7 and 8 MHz channel bandwidths

    *  Support for single- and multi-frequency networks

Support for additional features, such as European L-band, is planned for future products. For more information, please visit www.cdmatech.com/ubm. QUALCOMM is planning to demonstrate UBM at 3GSM World Congress in Barcelona.

QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of UBM chipsets on a timely and profitable basis, the extent and speed to which handset manufacturers adopt UBM chipsets, the extent and speed to which operators adopt UBM-enabled handsets, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.

QUALCOMM is a registered trademark of QUALCOMM Incorporated. Mobile Station Modem, MSM and FLO are trademarks of QUALCOMM Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

    QUALCOMM Contacts:

    Kira Lee, QUALCOMM CDMA Technologies
    Phone:  1-858-845-7571
    Email:  qctpublicrelations@qualcomm.com

    Tina Asmar, Corporate Communications
    Phone:  1-858-845-5959
    Email:  corpcomm@qualcomm.com

    John Gilbert, Investor Relations
    Phone:  1-858-658-4813
    Email:  ir@qualcomm.com